| 摘要 |
<p>PURPOSE:To paste an adhesive tape on the semiconductor wafer without pressing, to automate a tape bonding process and to shorten bonding time and paste the tape on the wafer uniformly by each decompressing an upper airtight chamber and a lower airtight chamber mutually separated by the adhesive tape and pasting the adhesive tape on the semiconductor wafer by the difference of atmospheric pressure. CONSTITUTION:A mounting frame 23 is placed on a sliding table 7 under the state in which the semiconductor wafer 24 is encased in the central opening 23a of the mounting frame. The sliding table 7 is lifted and inserted into a lower housing 2', and the surfaces to be bonded of the semiconductor wafer 24 and the mounting frame 23 are arranged near the bonding surface of the adhesive tape 25 while the lower housing 2' and the sliding table 7 are closed in an airtight manner by an O ring 10. An upper housing 2 is dropped, the adhesive tape 25 is pushed against the upper end surface of the lower housing 2' by an O ring 9 fitted to the lower end surface of the upper housing, and a section between the upper and lower housings is sealed in an airtight manner. The upper airtight chamber and the lower airtight chamber are each decompressed, and the adhesive tape 23 is each pasted on the upper surfaces of the semiconductor wafer 24 and the mounting frame 23 by the difference of atmospheric pressure between both chambers.</p> |
