发明名称 MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To facilitate to form a lamination layer form lead frame, and to enable to attain mass production of the lead frame at low cost by a method wherein metal plates of the plural number are bent in a V type and a reverse V type alternately to be resin molded in one body, then openings are formed at the concentrating parts and the metal plates are cut in pieces, a metal bar coated with an insulating material is inserted in the opening, and slicing in the perpendicular direction thereto is performed. CONSTITUTION:A thermally workable plastic plate is inserted between the top force 4a and the bottom force 4b of a metal mold 4, and press processing is performed. Then thin metal plates 12, 12 and thermally workable plastic plates 21, 21 are inserted between the top force 14a and the bottom force 14b of a metal mold 14 putting inside the plastic member 11 mentioned above as to put the member between the plates, and a press is performed to obtain the laminate of the plastic plates and the metal plates. The same process is repeated thereafter to obtain a lamination layer block body 10. Then a cylindrical member 15 is inserted in a penetrating hole formed by drawing out a cylindrical part. The cylindrical member thereof is formed as to have a diameter insertable firmly in the penetrating hole 13 mentioned above by coating with an electrically insulating layer 15b of plastics on the side of a metal cylindrical member 15a. Then slicing is performed to the linear part to form a lead frame.
申请公布号 JPS59113651(A) 申请公布日期 1984.06.30
申请号 JP19820222876 申请日期 1982.12.21
申请人 TOSHIBA KK 发明人 IZUMIDA TOMOHITO
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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