| 摘要 |
PURPOSE:To remove a foreign material on the surface of a semiconductor wafer while always optimally maintaining the contacting pressure of a brush with the surface of the wafer by providing a pressure sensor. CONSTITUTION:A base 2 is rotated at a high speed, and a brush 4 pushes down the upper surface of an Si wafer 1 while rotating. This pressure is detected by a contact type pressure sensor 7 through the base 2, a ball bearing 5 and a spacer 6. When the elevational position of the brush 4 is controlled by the detection output, the optimum contacting pressure can be adjusted. |
