| 发明名称 |
Method of collective manufacture of microwave frequency diodes with incorporated encapsulation and diodes thus obtained. |
| 摘要 |
The invention relates to microwave frequency diodes and to their method of manufacture. The subject of the invention is a diode manufactured by a collective method in which the junction is inserted into two superimposed slices of dielectric 12 and 18 serving as encapsulation, avoiding the use of a package. Application in particular to avalanche diodes operating in the 94 GHz band. <IMAGE> |
| 申请公布号 |
FR2538616(A1) |
申请公布日期 |
1984.06.29 |
| 申请号 |
FR19820021873 |
申请日期 |
1982.12.28 |
| 申请人 |
THOMSON CSF |
发明人 |
MARIANNE BOUDOT, RAYMOND HENRY, MICHEL HEITZMANN ET CLAUDE CARRIERE |
| 分类号 |
H01L21/329;H01L21/78;H01L23/051;H01L23/31;(IPC1-7):01L21/78;01L29/86 |
主分类号 |
H01L21/329 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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