| 摘要 |
<p>PURPOSE:To produce particle boards having a high chip content and a sufficiently high bonding property even when the hot pressing time is short by a method in which a mixture of water, surfactant and a polyisocyanate compound is coated on the surfaces of wood chips and the wood chips are bonded with each other. CONSTITUTION:Water, 0.1-10wt% surfactant (e.g., sodium lauryl sulphate), and 20-80wt% polyisocyanate compound with two or more isocyanate groups in its molecule (e.g., methylene-bridged polyphenyl polyisocyanate) are mixed together. The mixture is coated on the surfaces of wood chips within 10min, and the wood chips are molded by hot press at 150-180 deg.C. Particle boards which are excellent in water resistance and weather proofness and releasing lesser amounts of formaldehyde can thus be obtained.</p> |
