| 摘要 |
PURPOSE:To form an appropriate rough surface without resulting in damage of a work and to perform drilling processing at accurate positioning, by preforming running surface through plating on the surface of the work whereon drilling processing is performed through a drill. CONSTITUTION:In case accurate drilling processing is performed by a drill, a rough surface is formed by preplating on the surface of a work whereon drilling is done. In case a large number of through holes is provided in a printed circuit board, for example, a plated layer having sufficiently large unevenness is formed on the surface of a printed wiring pattern through electroplating. With this construction, the surface of the printed circuit board to be processed can be roughed without causing a slip and defectiveness of the wiring pattern of the same board, through which a through hole can be formed at accurate positioning. |
