| 摘要 |
PURPOSE:To obtain sufficient soldering strength by upward bending a section where a lead extended from the side wall of a package is soldered so as to incline to the bottom of the package once along the direction of the extension and downward bending the nose section of the section. CONSTITUTION:A large number of the leads 2... connected to semiconductor pellets are extended from the side wall of a resin seal layer 1. These leads 2... are bent up to a position slightly lower than the bottom of the resin seal layer 1, and bent upward so as to slightly incline to the bottom of the resin seal layer 1, and their nose sections are bent downward again. Consequently, the nose surfaces of the leads 2... run approximately parallel with the bottom of the resin seal layer, and are directed downward. Sections more front that the upward bent sections of the leads 2... are soldered. Since the nose surfaces of the leads 2 are directed downward, the nose surfaces are filled sufficiently with solder 5 though the solder wetting property of the end surfaces is deteriorated. |
