| 摘要 |
PURPOSE:To easily strip off an acrylic type photoresist from a metallic surface without using any solvent by rapidly cooling said resist bonded to the metallic surface in a cooling medium kept at a specified temp. CONSTITUTION:An acrylic type photoresist bonded integrally to a metallic surface is subjected to necessary exposure, development, and etching processes especially in a circuit board to form a circuit, and it is rapidly cooled to <=0 deg.C, preferably in a -20 deg.C--200 deg.C cooling medium. The medium may be liquid and it can be selected optionally, e.g. from liquefied nitrogen, liquefied CO2, a dry ice-methanol mixed system, and an atm. cooled with said medium, etc. After treatment with such a cooling medium, the photoresist sticking to the metallic surface can be removed perfectly by sucking it with a vacuum suction machine like an electric cleaner when needed, or blowing it off with compressed air, or using the like auxiliary means. |
