发明名称 |
HEAT-RESISTANT THERMOSETTING RESIN COMPOSITION |
摘要 |
<p>A thermosetting resin composition containing as essential resin components (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal, and a latent curing agent or a curing accelerator which is at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom, is found to be capable of B-staging with good storage stability and provides a heat-resistant resin composition having excellent electric characteristics at high temperatures after curing. The composition can suitably be coated on a glass cloth or a mica tape to give a pre-preg tape which can maintain its flexibility for a long time.</p> |
申请公布号 |
DE3067898(D1) |
申请公布日期 |
1984.06.20 |
申请号 |
DE19803067898 |
申请日期 |
1980.12.04 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MIKOGAMI, YUKIHIRO;ITO, TAKEO;WADA, MORIYASU |
分类号 |
C08G59/00;C08G59/40;C08G59/56;C08G59/68;C08G59/70;C08G73/12;C08L63/00;H01B3/04;H01B3/30;(IPC1-7):08L63/00;08G59/40;08L79/08;01B7/34 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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