| 摘要 |
A semiconductor integrated circuit supporter on which a heating element is dielectrically provided, said supporter comprising a package, printed circuit board, mother board, etc. for supporting a semiconductor integrated circuit which includes devices such as transistors. The heating element provided on said semiconductor integrated circuit supporter is capable of heating the whole or a required part only thereof so that the semiconductor integrated circuit is preheated to a temperature required for its normal operation with precision and stability thereby improving the accuracy and reliability of various devices of which a semiconductor integrated circuit is composed as well as the control by said devices. |
