发明名称 |
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE |
摘要 |
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring. |
申请公布号 |
GB2083283(B) |
申请公布日期 |
1984.06.20 |
申请号 |
GB19810025494 |
申请日期 |
1981.08.20 |
申请人 |
HITACHI LTD;HITACHI MICROCOMPUTER ENGINEERING LTD |
发明人 |
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分类号 |
H01L21/822;H01L21/31;H01L21/3205;H01L23/29;H01L23/31;H01L23/52;H01L23/58;H01L27/04;H01L29/40 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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