| 摘要 |
<p>Polyalloy catalytic coating formulations are included in a multiple bath system or composite bath in order to prepare a metallic substrate surface to enhance subsequent plating thereover of nickel, cobalt or polyalloys including nickel or cobalt. Within this bath system, these catalytic formulations are rinsed Subsequent to their application onto the substrate and prior to the electoless deposition thereover. Improved products such as printed wiring boards are provided that are resistant to the development of bridging within the circuitry pattern and to undesirable increases in the conductivity of the board at locations other than on the circuitry pattern to produce printed wiring boards that are extremely resistent to developing short circuiting problems. Such properties are achieved, in large measure, because copper specks that are left embedded on the non-conductive board do not have any substantial electroless plating thereon.</p> |
