| 摘要 |
PURPOSE:To efficiently radiate the heat generated at a semiconductor chip by providing a heat proof insulating material between a semiconductor chip and a substrate. CONSTITUTION:After forming a thick film 2, dams 4 and solder platings 3 on a ceramic substrate 1, polyimide resin 6 is dropped in the adequate amount of the area to which a semiconductor chip is to be bonded of the ceramic substrate 1. Succeedingly, a semiconductor chip 5 to be bonded to the substrate 1 is temporarily fixed to the specified area and is then placed in the furnace at a temperature of about 350 deg.C for the soldering. The products having completed the soldering are insufficient in hardening of resin and therefore they are subjected to the hardening for 2-3hr at 250-300 deg.C. The hardened polyimide resin has a thermal conductivity of 0.0007-0.0015cal/C.sec.cm which is almost equal to that of the epoxy resin used in general as the resin sealing material. When it is compared with that where air exists between semiconductor chip 5 and substrate 1, thermal transfer is carried out by the thermal conduction mechanism and heat radiation efficiency can be improved excellently. |
