| 摘要 |
An adhesive resin application system which requires no external heating apparatus, and which is operative in the absence of a reactive atmosphere, is disclosed. The system provides its own heat by employing an adhesive material containing reactants which react exothermally when electrically ignited. After ignition of the reactants, sufficient heat energy is liberated by the exothermic reaction either to plasticize a thermoplastic resin or to cure a thermosetting resin and therby bond together two closely spaced objects. This application is a continuation-in-part of application Ser. No. 489,006, filed Apr. 27, 1983, which is a continuation-in-part of application, Ser. No. 929,120, filed July 28, 1978, both now abandoned.
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