| 摘要 |
PURPOSE:To make small the size of an exposure device and improve exposure accuracy by an apparatus wherein connection of a driver with vertically movable elements is switched by a turning-over switch to displace a displacement mechanism to the exposure part. CONSTITUTION:A diaphragm type chuck 18 is arranged on the wafer bearing surface of a chuck case, and the lower surface of the chuck 18 is supported by a number of vertically movable elements 31C. The lower surface of the chuck 18 comes into close contact with the upper ends of the vertically movable elements 31 through vacuum suction, and those of the vertically movable elements 31 which locate in the exposure area and the circumference thereof are switchably connected to drive means. When the vertically movable elements 31 are operated, the entire gradient of the chuck 18 can be changed and, when a vacuum pressure is applied to the space defined by a base, case 16 and the chuck 18, the chuck 18 is pushed with the atmospheric pressure to move downwards until it comes into contact with a chip 27 of a vertically movable element 24, whereupon it is supported by the vertically movable element 24. Since the wafer is sucked to be supported by the chuck 18, the wafer is also deformed following the chuck 18. |
