| 摘要 |
PURPOSE:To bring a flexible soldering carrier sheet to the state easy to be exfoliated after a reflow, and to prevent the oxidation of a flux in solder paste by previously soldering a metallic electrode section by using the sheet. CONSTITUTION:Solder paste 16 is printed at positions being in contact with the metallic electrode sections 13 on the flexible sheet 15, such as glass cloth or a polyimide group heat-resisting sheet or a sheet, in which glass cloth is fixed with polyimide group paints, or the like. Semiconductor pellets 11 are held between the flexible sheets 15, and the reflow is executed in a forming gas oven. A gas such as a mixed gas of 85% nitrogen and 15% hydrogen is used as the forming gas, and the oxidation of the flux in solder paste 6 is prevented. The solder paste 16 being printed moves on the metallic electrode sections 13 on the semiconductor pellets 11 by the reflow. |
