发明名称 Manufacture of moulded pieces held at temperature by heating, for subsequent thermal treatment
摘要 The present addition is aimed at improvements to the device which is the subject of the main patent. According to the present addition, current-conducting particles 8 are distributed uniformly or otherwise in the mass of a mould 1, in a density capable of permitting the passage of a current supplied by an electrical supply source connected to electrodes 9 firmly attached to the wall of the mould 1. The device of the addition permits the manufacture of any moulded pieces whatsoever with control of the temperature of the moulding cavity. <IMAGE>
申请公布号 FR2537472(A2) 申请公布日期 1984.06.15
申请号 FR19820020961 申请日期 1982.12.14
申请人 SCHISSLER JEAN MARIE 发明人
分类号 B22D27/02;B22D27/04;(IPC1-7):B22D27/04 主分类号 B22D27/02
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