| 摘要 |
PURPOSE:To reduce the occurrence of cold marks, while preventing the lowering of resin temperature at pressurizing process, by pressurizing and cooling the thermoplastic resin supplied at molten state onto the metal mold whose surface part is covered with the thermal nonconductive material having specified thermal conductivity. CONSTITUTION:The surface part of a metal mold with which thermoplastic resin at molten state is in contact since before being pressurized, is covered with the thermal nonconductive material having the thermal conductivity of 6X10<-3> cal/cm.sec. deg.C or less. Onto this metal mold, thermoplastic resin is supplied at molten state and pressurized and cooled, and thus a formed product is obtained. For instant, mylar film is used as a thermal nonconductive layer 5, and on said film, polypropylene resin 6 molten at 220 deg.C is supplied. When said resin 6 is pressed, while lowering an upper platen 1 by pressurizing, the formed product may be obtained, and then the metal mold temperature is kept at 70 deg.C, thereby obtaining the formed product excellent in appearance without cold marks such as luster defect or creases on the whole surface containing an outer bottom part A. |
