| 摘要 |
PURPOSE:To improve efficiency of handling operation of sealed devices as well as to prevent electrostatic damages by leaving projecting pieces connected to frames from a resin sealing region in addition to leads. CONSTITUTION:Connecting pieces 8 connecting each corner of a rectangular dam 4 to an outer frame 5, an inner frame 6 and one of corners of said frames 5 and 6 and pieces 11 projecting into a resin sealing region 10 from each corner of said dam 4 are provided. These pieces 8 and 11 are not in contact with leads 9. A semiconductor pellet 2 is mounted to a tab 3, followed by resin sealing, after which the dam 4 is cut apart and the leads 9 are cut from the roots at the frames 5 and 6 to leave only dam parts of the projecting pieces 8. If measurement or stamping is done under this condition, handling is easy and terminals are not bent and also electrostatic damages are not caused. Finally the projecting pieces 11 is cut thereby a semiconductor device 18 having flat leads 9 is obtained from a lead frame 1. |
