| 摘要 |
PURPOSE:To make small an alignment error by forming an alignment mark and a frame surrounding it on the lower basic layer provided on a semiconductor substrate in the wafer alignment process, applying a resist through a layer to be etched on these mark, frame and lower basic layer and then executing the alignment. CONSTITUTION:An alignment mark 23 and a frame 24 surrounding it are formed on the lower basic layer 21 provided on the semiconductor substrate and the layer 21 is used as the layer 22 including them. The laminated film 25 to be etched and the resist film 26 are deposited on the layer 22 and thereafter alignment is carried out. Thereby, unevenness of resist 27 generated on the mark 23 due to existence of frame 24 of mark 23 is remarkably reduced as compared with that generated when the frame 2 is not provided. Accordingly, alignment error becomes small and resist coating on the mark becomes uniform. |
