| 摘要 |
PURPOSE:To prevent a semiconductor wafer from being broken or cracked, by forming a recessed part on a part opposed to a wafer end part of a face of the side contacting with the wafer of a photomask, when forming a photoresist pattern on the wafer. CONSTITUTION:A photoresist 5 is dropped down onto the surface of a semiconductor wafer 4, rotated at a high speed by a spinner, and the photoresist is applied onto the wafer 4. On the other hand, a recessed part 7 whose depth is >=5mum is formed in the vicinity of the circumference of a face of the side contacting with the wafer 4 of a photomask 1. Subsequently, this photomask 1 is made to adhere closely onto the wafer 4 on which the photoresist is applied, and a photoresist pattern is formed by irradiation of light. In this way, when applying the photoresist 5 to the wafer 4, even if a heaped up part 6 is generated in the circumferential part, the heaped up part 6 is contained in the recessed part 7 of the photomask 1, therefore, the wafer 4 and the photomask 1 are made to adhere closely and satisfactorily. |
