发明名称 Bonding resin composition.
摘要 <p>Disclosed is a bonding resin composition composed of a blend consisting essentially of (a) maleic anhydride-modified, stereoregular polypropylene having a combined maleic anhydride concent of about 0.5-0.8% by weight of said modified polypropylene, and (b) base polymer material at about 25 parts by weight per part by weight of said maleic anhydride-modified polypropylene. The base polymer material is selected from a group of two combinations. One combination consists essentially of stereoregular polypropylene and essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 25% by weight of the product. The weight ratio of the polypropylene to the product is about 1:3-3:1. The other combination consists essentially of essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 7% by weight of the product, and essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 25% by weight of the product. The weight ratio of the two products is about 1:3-3:1. Also disclosed is a laminate of the bonding resin composition and a metal such as steel or aluminium. Further disclosed is a method for making the laminate.</p>
申请公布号 EP0110505(A1) 申请公布日期 1984.06.13
申请号 EP19830305047 申请日期 1983.09.01
申请人 HERCULES INCORPORATED 发明人 LIU, CHIA-SENG
分类号 C08L23/00;B32B15/08;C08L7/00;C08L21/00;C08L23/12;C08L23/16;C08L23/26;C08L53/00;C08L101/00;C09D123/02;(IPC1-7):08L53/00;09J3/00;09D3/00;08L23/12;08L51/06 主分类号 C08L23/00
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