| 摘要 |
PURPOSE:To make it possible to seal a high voltage diode element, by connecting the tip part of a second external lead wire, whose tip is machined in a spherical surface shape, to an electrode bump, thereby omitting the restriction on the withstand voltage imposed by the height of the electrode bump. CONSTITUTION:A tip part 4 of an external lead wire 3 is connected to an electrode bump 2 and has a spherical surface 8. Said surface 8 is connected with the electrode bump 2. Therefore, the discharge starting voltage between a diode substrate 1 and the external lead wire 3 becomes a high value, which is determined by the minimum facing interval (l) that is longer than the height of the electrode bump 2. Thus it is possible to seal a diode element, whose voltage is higher than the discharge starting voltage that is determined by the height (h) of the electrode bump. |
