| 摘要 |
PURPOSE:To obtain an airtight sealed type device, having no characteristic deterioration, which can be assembled automatically by a method wherein one of the insulated metalized layers located on the protruded part of a casing body is wire-connected with the ring-shaped metalized layer located on the upper surface of the metalized layer on the region other than the protruded part, and the metalized layer on the inner wall of a cavity is fixed to the cover member which is connected to the lead terminal on the upper surface passing through a penetrated hole. CONSTITUTION:A ceramic substrate 36 has a protruded part 34 in the center, a chip mounting metalized layer 31 which is formed in striped form from the center to the end part, input and output metalized layer 32 and 33 at the symmetrical position, and a ring-shaped metalized layer 35 at the part other than the protruded section. A ceramic cavity 45 has an airtight sealing metalized layer 38 on the bottom face of outer circumference, a cavity surrounding the FET chip 14 of the layer 31 at the center part on the lower surface, and metalized layers 42-44 which is conducted to gate-drain-source electrode lead terminal 34-41 on the upper surface and said ceramic cavity 48 is connected to metalized layers 46 and 47 on the internal wall through penetrating holes 48 and 49. The base stand and the cavity are adhered using a sealing solder material 37. According to this constitution, an automatic assembling can be performed because there is no structure which obstructs automation of wire connection, thereby enabling to make a parasitic element of the casing smaller in size. |
