| 摘要 |
PURPOSE:To mount a minute element easily attaching an affinitive solder material to the nose of a spatula heated at the melting point or more of a solder material, extending the solder material on a semiconductor substrate by the nose of the spatula and pushing the element against the solder material. CONSTITUTION:A copper plate 10 is heated at approximately 250 deg.C, and Pb-Sn solder 11 in predetermined length is pressure-welded. The substrate 10 is heated at the melting point or more of solder 11 and melted. The melted solder 11' generates an oxide film on the surface, and is changed into a sphere. The nose of the spatula 12 in copper is heated at the melting point or more of solder 11', affinitive solder 13 of the same composition as solder 11' is attached to the nose, the spatula 12 is slid, and solder 11' is extended flatly and fitted to the substrate 10. The desired semiconductor element 14 is pushed against solder, and mounted. According to the constitution, the minute element of 2mm. square or less be mounted easily and positively onto the substrate of inferior solder moistening property. |
