| 摘要 |
PURPOSE:To improve yield on assembly and reliability by executing an accelerated life test, etc. by conduction under the state of a wafer before assembling and mounting an IC pellet and removing an initial defect. CONSTITUTION:The wafer in which diffusion and wiring processes are completed is conducted, the accelerated life test is executed, and the initial defect is removed. When the IC is assembled by using the IC pellet as an acceptable, the cost of materials and man-hours are not wasted, cost can be reduced, and reliability is also improved. |
