发明名称 FEEDTHROUGH SEALED WITH THERMOSETTING RESIN
摘要 PURPOSE:To obtain a feedthrough with superior adhesive strength, water resistance and moisture resistance by forming a copper oxide film by blackening on the surface of a hole pierced in a feedthrough die, passing an optical fiber through the hole, and adhering the fiber to the die with the copper oxide film in-between. CONSTITUTION:A copper oxide film 4 is formed by blackening on the surface of a hole 1A pierced in a feedthrough die 1. An optical fiber 2 is passed through the hole 1A, a thermosetting sealing resin 3 is injected into the hole 1A, and the fiber 2 is adhered to the die 1 with the resin 3 in a state in which the film 4 is present between the hole 1A and the resin 3. Since copper oxide is the principal component of the film 4, the surface of the hole 1A is more hardly affected by molecules of water than a copper surface having no copper oxide film, and the density of hydrogen bond to hydroxyl groups in the resin 3 is increased. Accordingly, by forming the film 4, the adhesive strength of the die 1 to the resin 3 can be increased.
申请公布号 JPS5999410(A) 申请公布日期 1984.06.08
申请号 JP19820207550 申请日期 1982.11.29
申请人 NIPPON DENSHIN DENWA KOSHA 发明人 MARUNO TOORU;SASAKI SHIGEKUNI;NAKAMURA KOUZABUROU
分类号 C03C27/04;G02B6/00;G02B6/44 主分类号 C03C27/04
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