发明名称 METHOD OF CONNECTING DOUBLE-SIDED CIRCUITS
摘要 <p>Conductive wiring members, such as copper foil wiring (2a), (2b) printed on both sides of an insulating substrate (1), or the like, are connected by passing a conducting wire (7), (9) provided with a solder ball (8), (10) through a through-hole (3) in the vicinity of the conductive wiring members (2a), (2b), and then soldering the conductive wiring member (2a) or (2b) to the part of the conducting wire (7) or (9) on one surface by dip soldering or flow soldering, thereby melting the solder ball (8) to connect the part of the conducting wire (7) or (9) to the conductive wiring member (2a) or (2b) on the other surface. </p>
申请公布号 WO1984002248(P1) 申请公布日期 1984.06.07
申请号 JP1983000417 申请日期 1983.11.22
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