ELECTRICAL CIRCUIT ASSEMBLY

摘要

The invention describes a method of producing an electrical circuit incorporating integrated circuits on semiconductor chips, which comprises mounting the electrical components (10) which are to constitute the circuit including the unpackaged semiconductor chips on an insulating substrate (12) in such a manner that the contact areas 14 of the components lie in a substantially flat plane, and depositing a conductive pattern over the substrate to establish electrical connection between the components of the circuit.