| 摘要 |
A contact mounting press for mating press fit electrical contacts with plated-through apertures in an electrical circuit board comprises a vertically displaceable press head which forcefully displaces the contacts into the plated-through apertures. The press head includes a device for gripping the contacts and a contact locator including a locating tool having a plurality of notches, and a wire which opposes the tool. The locating tool and the wire are brought together to positively locate each contact within one of the notches and the press head with the contact locator means are lowered in a rigid single motion to insert the ends of the contacts into the circuit board apertures. A control device separates the locating tool and the wire to disengage the contacts after the ends of the contacts have been inserted into the circuit board apertures, and further downward motion of the press head forcefully displaces the contacts into the circuit board to achieve a press fit.
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