| 摘要 |
A solar cell fabrication procedure is described which is characterized by (1) formation of a "polysilazane" coating on a silicon substrate, (2) photo-lithography of the polysilazane coating to form a plating mask pattern, (3) a heating step which removes residual photoresist and converts the polysilazane coating to a denser form of silicon nitride having a reduced etch rate, and (4) use of densified silicon nitride as a mask for the plating of electrode metal and also as an anti-reflection coating.
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