| 摘要 |
PURPOSE:To prevent the sharp rise in temp. of a material to be worked and to suppress the generation of a solder ball by preheating the material at a relatively low temp. then heating the same to the melting temp. of the solder or above and performing soldering. CONSTITUTION:A substrate 2 is placed on a receiving base 25, and one end part 1a of the substrate 1 subjected to solder plating 3 is superposed on the solder plating 4 of a substrate 2. The substrates 1, 2 are tentatively fixed by double- coated adhesive paper 5 to match the wiring patterns to each other. The base 25 is moved in this state to the position right under a heater chip 23. A piston rod 14 is then lowered to position the groove part 23a of a hot plate 16 across one end part 1a of the substrate 1 and in this state the rod 14 is stopped for a short time. The substrates 1, 2 are thereby heated to about 110 deg.C. The rod 14 is moved upward to move further the base 25 to the position right under a heater chip 24. A press plate 26 is lowered to press the substrate 1 and a piston rod 15 is lowered to melt the solder platings 3, 4 by the heater chip 24 of a hot plate 17. The rod 15 is moved upward and air is ejected from a cooling pipe 27 to solidify the molten solder. |
