| 摘要 |
PURPOSE:To improve the mounting density per area by three-dimensionally stacking semiconductor elements on a mounting substrate and thus realize high performance and miniturization by mounting the first chip on a case or a dielectric substrate of a small area by flip chip system. CONSTITUTION:The first semiconductor element 2 in contact with the substrate is formed into a structure with bumps 6 so as to perform flip chip assembly, and then soldered to the case substrate 1 whereon a connection pattern corresponding to the bumps is previously formed. Next, the second semiconductor element 3 manufactured by a normal process is superposed on the first semiconductor element and adhered by means of e.g. a conductive adhesive. Then, the adhesion is made firm by heating if necessary. The second semiconductor element 3 is connected to case side connection terminals 7 by normal wire bonding. In this case, since the first semiconductor element is soldered and can not put in a very high temperature, the wire bonding of ultrasonic system is desired. |
