| 摘要 |
PURPOSE:To prevent the generation of defectives due to working mistake and enable to make the processing automatic and unmanned by a method wherein conditions for manufacturing or inspecting a wafer to be processed are written on the wafer itself. CONSTITUTION:In the neighborhood of an orientation flat 2 formed at a part of the circumstance of the wafer 1, a code which represents the conditions for manufacturing or inspecting the wafer 1, various kinds of specifications of manufacture or inspection such as ion implaning energy, implanting time or inspecting time, is marked on the wafer surface as notches 3. The notches 3 are scanned with a code reader 5, and the information written on the wafer 1, i.e., manufacturing or inspecting conditions are detected and read out from the scanning speed and intervals for marking the information. The read information is fed from the code reader 5 to a computer 6 and decoded, which is then converted into the actual manufacturing or inspecting conditions, based on the inputted information, and inputted to each processor 7. According to the input, the processor 7 performs desired manufacturing or inspecting work to the wafer 1. |
