发明名称 DISPOSITIVO DE CONEXION.
摘要 <p>The connection system is based on an array of terminal sockets (3) set in an insulating baseboard and interconnected by a grid of conducting strips (15,16). Conducting strips protrude from the orifices of each socket to allow connection to external circuit elements. Interconnection between specific sockets is controlled by the placement of breaks (21) in the interconnecting strips. Sockets may be joined electrically by more than one path thus increasing the allowable current flow between them. The assembly is constructed by first fixing the conducting strips to a base. An insulating layer containing a matrix of holes corresp. to the strips is then fitted and the grid of conducting interconnections is fixed, for example by a thermo-setting adheisve, to the insulating layer. A pre-tooled punch is then applied to the grid to cut the gaps in the tracks. An insulating layer, which can be in the form of a resin, is deposited on top of the grid automatically filling the gaps in the tracks. A system with two or three conducting grids can be made.</p>
申请公布号 ES271352(Y) 申请公布日期 1984.06.01
申请号 ES19520002713U 申请日期 1983.04.07
申请人 发明人
分类号 H05K1/00;H05K3/20;(IPC1-7):05K7/02 主分类号 H05K1/00
代理机构 代理人
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