| 摘要 |
The invention relates to the techniques of applying electrolytic coatings. The device forming the subject of the invention is characterised in that the system 7 ensuring the desired direction of the flow of heat-transfer fluid 2 is constituted by a closed chamber 8 comprising inlet and outlet nozzles for the heat-transfer fluid and openings 13, for the passage of boards to be treated, made in mutually opposing walls 11, 12 of the chamber 8, transversely to the direction of the flow of heat-transfer fluid, the mechanism for transporting the said boards being placed inside the chamber 8. The invention is particularly applicable to the reflow of the electrolytic coatings on printed-circuit boards in radioelectric installations. <IMAGE>
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