| 摘要 |
PURPOSE:To prevent the warp of a substrate and prevent breakdown by reducing the thermal stress generated in an Si element at the time of brazing by a method wherein the junction surface of a heat conductive member is so constructed as to be restrained to the junction surface of the substrate. CONSTITUTION:A recess 10 is formed in the Mo substrate 5 of a small coefficient of thermal expansion, and the junction surface of a copper stud 3 which is the high heat conductive member of a large coefficient of thermal expansion is fitted into the recess 10 and thus joined to the substrate 5. A compression stress generates in the Mo plate 5 when the Si element 9 is brazed to the Mo plate 5, but the side surface of the copper stud 3 restrains the warp of the Mo plate 5, therefore the warp of the Mo plate 5 becomes less, and then the thermal stress generated in the Si element 9 reduces. |
