发明名称 DEVICE FOR WIRE BONDING
摘要 PURPOSE:To enable to perform a stabilized ball formation making use of a wire which is easily oxidized when a ballup is performed by a method wherein, at the tip of the metal thin wire to be led out from a capillary, the first means with which nitrogen or inert gas will be supplied is provided in the vicinity of the part which will be turned to ball-like form by electric discharge and the second means which supplies nitrogen or inert gas is provided on the circumference. CONSTITUTION:The wire bonding device consists of a nozzle 8, which is formed in such a manner that the direction of nitrogen or inert gas stream and the direction of electric discharge by an electric torch will be made in parallel with each other, and a nozzle 9 with which said nozzle 8 is surrounded. As a gas stream in parallel with the direction of electric discharge can be formed by the nozzle 8 located directly above the position where the ball is formed, a stabilized ball formation can be performed. A protective atmosphere is formed around the nozzle 8 located in the center by the nozzle 9, and this makes the atmosphere at the ball forming position more completely than the case where the nozzle 8 is independently present. As a vertical movement is performed too fast with the nozzle 8 only, the diffusion of oxygen in the air can not be prevented completely. Therefore, the nozzle 9 is provided and the completeness of atmosphere is increased by doubly protecting the ball formation position.
申请公布号 JPS5994837(A) 申请公布日期 1984.05.31
申请号 JP19820205735 申请日期 1982.11.24
申请人 NIPPON DENKI KK 发明人 KAMIJIYOU ATSUSHI
分类号 H01L21/60 主分类号 H01L21/60
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