发明名称 REDUCING CHARGING EFFECTS IN CHARGEDPARTICLE-BEAM LITHOGRAPHY
摘要 <p>In a charged-particle-beam lithographic system, charge accumulation on the workpiece during alignment or writing can cause significant pattern placement errors. A film (16) formed directly under the resist layer (56) to be patterned is utilized as a charge-conducting medium during lithography. The pattern delineated in the resist layer (56) is transferred into the film (16) and subsequently into an underlying layer (20). The film (16) is highly compatible with standard lithographic and etching processes used to fabricate LSI and VLSI circuits.</p>
申请公布号 GB2085613(B) 申请公布日期 1984.05.31
申请号 GB19810024744 申请日期 1981.08.13
申请人 WE 发明人
分类号 H01L21/027;(IPC1-7):03C5/00;01L21/469 主分类号 H01L21/027
代理机构 代理人
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