| 摘要 |
PURPOSE:To detach the element easily by temporarily attaching the semiconductor element on a sheet through an adhesive layer containing a resol type phenol resin and heating the adhesive layer at 50 deg.C or more. CONSTITUTION:A natural rubber, a butyl rubber, etc. or an acryl group copolymer, in which a polymerizing monomer having functional groups, such as methyl acrylate, acrylamide, etc. and an unsaturated compound, such as styrene, vinyl acetate, etc. as necessary are copolymerized, or polyvinyl alkyl ether or the like is used as an adhesive substance. The resol type phenol resin (the softening point of 70-180 deg.C) is compounded to these substances, and a transfer and adhesion on a bonding is prevented. The phenol resin is compounded within a range of a 50-100pts.wt. to a 100pts.wt. base component when rubbers are mainly made contain and within a range of a 20-50pts.wt. when a base component is of an acryl group copolymer resin. When the adhesives are used, they are bonded firmly at the normal temperature and resist against various processes, and the semiconductor element can be sucked and detached easily without the transfer and adhesion by predetermined heating. |
