| 摘要 |
<p>PURPOSE:To prevent a breaking by forming a shallow groove while removing a fringe from one main surface side of a wafer, pasting an adhesive tape, adsorbing and fixing the wafer and cutting the wafer in response to the groove from the other main surface. CONSTITUTION:A laser absorbing material 8 is laminated annularly to the surface fringe of the wafer 1, and the shallow grooves 9 are formed in the XY directions. The tape 10 is pasted on the back, the wafer is adsorbed under vacuum and fixed, sections corresponding to the grooves 9 are dicing-processed from the surface side, and grooves 11 reaching the tape 10 are formed. Bending force is applied to the wafer 1 by the pushing force of an edge and the elasticity of the tape at that time, but cracks 12 are generated in the longitudinal direction from the bottoms of the grooves 9, and are not generated in the lateral direction, thereby the pellets 13 obtained have no acute angle section, and a short circuit by broken chips is prevented.</p> |
