| 摘要 |
PURPOSE:To seal the semiconductor with a resin without a porosity and burrs by connecting a cavity with a resin reservoir communicated with the inside to a cull by a wall opposed to a resin inflow port. CONSTITUTION:Resin supply paths 22 communicated with the molding cavities 23 are formed on both sides of the cull 20, and the resin reservoirs 25 are formed to the walls of the cavities 23 opposed to walls, to which the resin inflow ports 23a are formed, through resin outflow paths 24. It is preferable that one cavity 23 is connnected to one cull 20 through one path 22 and one reservoir 24 is formed. Accordingly to the die of the constitution, air in the cavities 23 is discharged rapidly, and resin shapes with no gross porosity are obtained easily. Since an excessive resin is reserved in the reservoir 25 in quantity smaller than the volum of the reservoir 25 according to the conditions of sealing previously set, the quantity of the resin charged into the cavity 23 can be kept constant, molding pressure can be reduced, and the number of burrs can be decreased. |
