| 摘要 |
PURPOSE:To obtain a printing head having a high assembling accuracy by a method in which a plate spring fixed to a frame is soldered with the armature of an electromagnetic device, and then a printing wire is soldered with a low- melting solder in such a way as to prevent the melting of the previously soldered part during the following soldering period. CONSTITUTION:The armature 8 of an electromagnetic device 10 is fixed to a plate spring 6 whose basal end is fixed to a frame 1, and a printing wire 9 is fixed to the free end of the armature 8 or the plate spring 6 to manufacture a printing head. In this case, the plate spring 6 is soldered with the armature 8 with the first solder (e.g., copper solder, etc.) 14, and the plate spring 6 or the armature 8 is soldered with the printing wire 9 with the second solder 15 (e.g., silver solder, etc.) having a lower melting point than the first solder to obtain an objective printing head. |
