发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To evacuate the gas, which generated when soldering wax material are melted, to the outside by a method wherein exhaust vents are formed at a seal cap. CONSTITUTION:A dual in-line type ceramic package is formed of a ceramic substrate 1, seal parts (wax material) 2, a seal cap 3 and exhaust vents 4. The exhaust vents formed at the cap 3 evacuate the gas which is generated when the cap is sealed. The exhaust vents 4 are filled up by soldering when the soldering is solidified, so a soldered sealing of a high airtight property is performed. According to this constitution, the generation of voids can be reduced, when compared with the case of using a soldered cladding cap in flat state.
申请公布号 JPS5992551(A) 申请公布日期 1984.05.28
申请号 JP19820202131 申请日期 1982.11.19
申请人 HITACHI SEISAKUSHO KK;HITACHI MAIKURO COMPUTER ENGINEERING KK 发明人 KITAMURA WAHEI;SATOU HAJIME;OOTSUKA KENICHI;SUZUKI HIROMICHI;MIKINO HIROSHI;KIMOTO RIYOUSUKE
分类号 H01L23/02;H01L21/50 主分类号 H01L23/02
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