MANUFACTURE OF RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate the warpage of products after molding by a method wherein a grade is provided on the surface of mold for resin sealing in such a manner that it is formed high in the center part and low at the circumferential part. CONSTITUTION:A semiconductor piece 2 is fixed to a supporting body 1, and when the circumference of said semiconductor piece 2 is coated by a resin layer 4, the inner surface of the resin molding molds is formed into special shape. To be more precise, the surface of the mold is graded in such a manner that the center part thereof becomes high and the circumferential part becomes low. By using the mold above-mentioned, the warpage on the back side of the supporting body 1 can be made zero.