| 摘要 |
In plastic-encapsulated power semiconductor devices, mechanical stresses occur at the metal-plastic interface and result in the formation of splits after frequent changes in load. The ambient atmosphere is consequently able to penetrate the interior of the encapsulation and impair the electrical characteristics. The stresses can be reduced if the terminal contacts consist either of flat (3, 8) or cup-shaped (2, 7) ductile metal foils which are directly in contact with the plastic (6). <IMAGE> |
