发明名称 DIE BONDING METHOD
摘要 PURPOSE:To eliminate the necessity of set-changing of magazine, make it possible to supply a large amount of lead frames to each device from the stacked magazines and improve working efficiency by continuously executing a series of processes for depression of island of lead frame into the recessed part, prefoaming and die-bonding. CONSTITUTION:A lead frame 1 is supplied sheet by sheet to the supply side of guide rail 12 from magazine 10 by the lead frame supply device 11. The lead frame is depressed by a punch 13a and lower die 13b of the island depression apparatus 13 and the island 2 is recessed. The depressed lead frame 3 is sent to the prefoaming apparatus 14 and a prefoam material 16 is dropped on the island 2 from a nozzle 14a. It is then sent to a die bonding apparatus 15, a collet 15a moves downward and the vacuum-sucking die 17 is bonded to the island 2 through the prefoaming material 16.
申请公布号 JPS5990934(A) 申请公布日期 1984.05.25
申请号 JP19820200430 申请日期 1982.11.17
申请人 SHINKAWA:KK 发明人 KUSHIMA YOSHIMITSU
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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