| 摘要 |
PURPOSE:To manufacture a package by an inexpensive means, and to prevent a damage to sections except an ROM section through the irradiation of X-rays by boring a hole to the chip loading section of a lead frame. CONSTITUTION:A semiconductor chip 2 and lead sections 1a are connected by bonding wires 4, molded by a mold by a plastic molding member 5, and cut out of the outer frame of the lead frame 1, and the lead sections 1a are bent. When the contents of the ROM of the semiconductor memory device are erased, X-rays of predetermined intensity may be irradiated through the molding member 5 and the chip loading section 1b from the back side of the semiconductor chip loading section as shown in the arrow. X-rays can transmit a section corresponding to the ROM region of the semiconductor chip 2 because the section coincides with the hole 1c, but X-rays are shielded by metallic member itself as the lead frame 1 and its thickness to sections except said section. |
