| 摘要 |
<p>PURPOSE:An adhesive composition, consisting of poly N-glycidyl epoxy resin, carboxyl group-containing nitrile rubber, fine powdery silica and clay treated with an onium compound, and having improved adhesive property, solder heat resistance and flexibility, and usable for printed circuit boards. CONSTITUTION:An adhesive composition prepared by incorporating (A) a polyglycidyl epoxy resin, e.g. a compound of formula II (R and R' are H or alkyl) having a group of formula I (n is 1-6), with (B) a carboxyl group-containing nitrile rubber obtained by carboxylating the terminals of acrylonitrile-butadiene rubber containing acrylonitrile and butadiene copolymerized in (5/95)-(45/55) molar ratio between the acrylonitrile and butadiene, (C) fine powdery silica, e.g. amorphous silica, or/and clay treated with an onium compound, preferably an ammonium compound, preferably in the following ratios; 0.05<=component (A)/component (B) <=2.0 and 0.01<=component (C)/components (A) and (B) <=0.8.</p> |
