| 摘要 |
A microstrip antenna 10 is presented having the construction of a circuit pattern 20 formed on a polymeric film 18, a foam or honey comb material 16 serving both as a dielectric and support for the circuit pattern, and a carrier or container 12 which serves both as a ground plane 14 and as a carrier or container to house the dielectric 16 and the circuit pattern 20, the assembly all being bonded together to form a rigid structure. <IMAGE> |
